The NVIDIA® Jetson AGX Orin Developer Kit includes a high-performance, power-efficient Jetson AGX Orin module, and can emulate the other Jetson Orin modules. You now have up to 275 TOPS and 8X the performance of NVIDIA® Jetson AGX Xavier in the same compact form-factor for developing advanced robots and other autonomous machine products. Supported by NVIDIA JetPack and use-case specific software platforms including Isaac for robotics, and Metropolis for smart cities, this developer kit provides everything you need to get started right away.

JETSON AGX ORIN MODULE

GPU NVIDIA Ampere architecture with 2048 NVIDIA® CUDA® cores and 64 Tensor cores

CPU 12-core Arm Cortex-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3

DL Accelerator 2x NVDLA v2.0

DLA Max Frequency 1.6GHz

Vision Accelerator PVA v2.0

Memory 64GB 256-bit LPDDR5 204.8 GB/s

Storage 64GB eMMC 5.1

Video Encode 2x 4K60 (H.265) | 4x 4K30 (H.265) | 8x 1080p60 (H.265) | 16x 1080p30 (H.265)

Video Decode 1x 8K30 (H.265) | 3x 4K60 (H.265) | 6x 4K30 (H.265) | 12x 1080p60 (H.265) | 24x 1080p30 (H.265)

REFERENCE CARRIER BOARD

CSI Camera Up to 6 cameras (16 via virtual channels) 16 lanes MIPI CSI-2 D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps)

PCIe* Up to 2 x8 + 1 x4 + 2 x1 (PCIe Gen4, Root Port, & Endpoint)

USB* 3x USB 3.2 Gen2 (10 Gbps), 4x USB 2.0

Networking 1x GbE, 1x 10GbE

Display 1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1

Other IO 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, PWM, DMIC & DSPK, GPIOs

Power 15W – 60W

Mechanical 100mm x 87mm, 699-pin Molex Mirror Mezz Connector, Integrated Thermal Transfer Plate

- Jetson AGX Orin module with heat sink and reference carrier board

- 802.11ac/abgn wireless Network Interface Controller

- USB-C power adapter and cord

- Quick Start and Support Guide

- 6 months warranty coverage

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